Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip

Title
Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip
Author(s)
신동길J.J. Lee[J.J. Lee]C.K. Yoon[C.K. Yoon]G.J. Lee[G.J. Lee]J.K. Hong[J.K. Hong]N.S. Kim[N.S. Kim]
Keywords
PACKAGES; SPECIMEN; STRENGTH
Issue Date
201501
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Citation
ENGINEERING FRACTURE MECHANICS, v.133, pp.179 - 190
Abstract
A method to measure the tensile adhesion of thin films on a silicon chip was developed. A new test machine was designed to obtain tensile adhesion by applying a single cantilever beam method. Self-alignment of the specimen was accomplished by a specially designed jig and mount. The specimen was designed to allow fabrication by using a commercial manufacturing process. The developed method was applied to measure the adhesion of die attach films having various thicknesses ranging from 5 mu m to 20 mu m. Adhesion between the film adhesive and the top surface of a silicon chip was successfully measured. It was shown that the measured adhesion was independent of crack length and robust against variation of the initial alignment of specimen. (C) 2014 Elsevier Ltd. All rights reserved.
URI
http://hdl.handle.net/YU.REPOSITORY/33652http://dx.doi.org/10.1016/j.engfracmech.2014.10.004
ISSN
0013-7944
Appears in Collections:
공과대학 > 기계공학부 > Articles
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