레이저센서를 이용한 비접촉식 두께자동측정기 개발

Title
레이저센서를 이용한 비접촉식 두께자동측정기 개발
Other Titles
Development of Automated Non-contact Thickness Measurement Machine using a Laser Sensor
Author(s)
신기열김수연조경철[조경철]
Keywords
Thickness Measurement(두께측정); Non-contact(비접촉); Laser Sensor(레이저센서); Statistic Process Control(통계적공정관리); PCB(인쇄회로기판)
Issue Date
201504
Publisher
한국기계가공학회
Citation
한국기계가공학회지, v.14, no.2, pp.51 - 58
Abstract
In this study, we developed an automated non-contact thickness measurement machine that continuously and precisely measures the thickness and warp of a PCB product using a laser sensor. The system contains a measurement part to measure the thickness in real time automatically according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The measurement machine was utilized to evaluate the performance at each step to minimize measurement error. At the zero setting for the initial setup, the standard deviation of the 216 samples was determined to be 5.52㎛. A measurement error of 0.5mm and 1.0mm as a standard sample in the measurement accuracy assessment was found to be 2.48% and 2.28%, respectively. In the factory acceptance test, the standard deviation of 1.461mm PCB was measured as 28.99㎛, with a Cpk of 1.2. The automatic thickness measurement machine developed in this study can contribute to productivity and quality improvement in the mass production process.
URI
http://hdl.handle.net/YU.REPOSITORY/32607http://dx.doi.org/10.14775/ksmpe.2015.14.1.051
ISSN
1598-6721
Appears in Collections:
공과대학 > 기계공학부 > Articles
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