Growth of highly conformal ruthenium-oxide thin films with enhanced nucleation by atomic layer deposition

Title
Growth of highly conformal ruthenium-oxide thin films with enhanced nucleation by atomic layer deposition
Author(s)
김수현박지윤여승민천태훈김민규[김민규]김형준[김형준]홍태은[홍태은]이도중[이도중]
Keywords
TIO2 FILMS; CAPACITORS; RUO2; MEMORY; OXYGEN; ELECTRODES
Issue Date
201410
Publisher
ELSEVIER SCIENCE SA
Citation
JOURNAL OF ALLOYS AND COMPOUNDS, v.610, pp.529 - 539
Abstract
Highly conformal and conductive RuO2 thin films were deposited without nucleation delay using atomic layer deposition (ALD) by zero-valent metallorganic precursor, (ethylbenzyl)(1,3-cyclohexadienyl)Ru(0) (EBCHDRu, C14H18Ru) and molecular oxygen (O-2) as a precursor and reactant, respectively. RuO2 thin films could be successfully prepared by controlling the process parameters, such as a reactant flow rate, a reactant pulsing time, a precursor pulsing time, and a deposition temperature. X-ray diffractometry, X-ray photoelectron spectroscopy, and secondary ion mass spectrometry analysis revealed that the formation of a RuO2 phase became favorable with increasing both the reactant flow rate and the pulsing time and with decreasing the precursor pulsing time and the deposition temperature. With the optimized pulsing conditions, the RuO2 film deposited at 225 degrees C had a tetragonal structure and exhibited excellent properties such as the low resistivity of 118 mu Omega-cm, the high density of 6.85 g/cm(3) close to the bulk value, and the negligible roughness of 033 nm. The growth rate of ALD-RuO2 was as high as 0.186 nm/ cycle on the SiO2 substrate and the number of incubation cycles was negligible as 2. The film showed excellent step coverage of similar to 100% onto 25-nm-width trench structures with an aspect ratio of 4.5. The ALD-RuO2 was highly stable up to annealing at 700 degrees C in both O-2 and N-2 ambient. Finally, the ALD-RuO2 film was evaluated as a bottom electrode of a metal-insulator-metal capacitor with a high-k (dielectric constant) ALD-TiO2 dielectric. The dielectric constant of ALD-TiO2 was confirmed to be as high as similar to 68. This extremely high dielectric constant was attributed to the formation of a rutile-structured TiO2 film on top of the ALD-RuO2 bottom electrode, as evidenced by high-resolution transmission electron microscopy analysis. (C) 2014 Elsevier B.V. All rights reserved.
URI
http://hdl.handle.net/YU.REPOSITORY/30690http://dx.doi.org/10.1016/j.jallcom.2014.04.186
ISSN
0925-8388
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공과대학 > 신소재공학부 > Articles
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