LEGO-like assembly of peelable, deformable components for integrated devices

Title
LEGO-like assembly of peelable, deformable components for integrated devices
Author(s)
송태섭Sangkyu Lee[Sangkyu Lee]Jaehwan Ha[Jaehwan Ha]Sungjin Jo[Sungjin Jo]Junghyun Choi[Junghyun Choi]Won Il Park[Won Il Park]John A Rogers[John A Rogers]Ungyu Paik[Ungyu Paik]
Keywords
ELASTIC CONDUCTORS; ELECTRONICS; CIRCUITS; CARBON; SUPERCAPACITORS; SEMICONDUCTORS; INTERCONNECTS; TRANSISTORS; LAMINATION; STRESS
Issue Date
201310
Publisher
NATURE PUBLISHING GROUP
Citation
NPG ASIA MATERIALS, v.5
Abstract
The development of various technologies has led to the advent of a variety of deformable devices. Despite significant technological advancement in this area, it is still challenging to integrate different devices due to limitations such as substrate issues and differences among growth and deposition conditions. Creating an interconnection between two different devices currently requires the use of metallic wires/lines to build electrical connections. Here, we demonstrate a LEGO-like assembly of the free-standing film of individually operable components encapsulated in a polymer overcoat layer, leading to the production of an integrated architecture without additional electrical connections. The free-standing components are produced by the peeling-off process. The sticky nature of the polymer layer enables the construction of supercapacitor arrays and simple RLC circuits by interlocking the individual components. We expect that this approach will enable the fabrication of a variety of custom-built devices using a LEGO-like assembly method.
URI
http://hdl.handle.net/YU.REPOSITORY/28791http://dx.doi.org/10.1038/am.2013.51
ISSN
1884-4049
Appears in Collections:
공과대학 > 신소재공학부 > Articles
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