Elimination of nanovoids induced during electroforming of metallic nanostamps with high-aspect-ratio nanostructures by the pulse reverse current electroforming process

Title
Elimination of nanovoids induced during electroforming of metallic nanostamps with high-aspect-ratio nanostructures by the pulse reverse current electroforming process
Author(s)
임지석한정진[한정진]한정원[한정원]이병수[이병수]김석민[김석민]김한성[김한성]강신일[강신일]
Keywords
ELECTRON-BEAM LITHOGRAPHY; PATTERNED MAGNETIC MEDIA; HIGH-THROUGHPUT; FABRICATION; ELECTRODEPOSITION; SIMULATION; SUBSTRATE; SYSTEMS; DESIGN; COPPER
Issue Date
201206
Publisher
IOP PUBLISHING LTD
Citation
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.22, no.6
Abstract
We studied a technique for fabricating metallic nanostamps with void-free, high-aspect-ratio nanostructures, using a pulse reverse current (PRC) electroforming process. During conventional electroforming of high-aspect-ratio nanostructures, a high current distribution is concentrated at the top and bottom corners, resulting in relatively fast growth of the nickel electroformed layer. This phenomenon leads to the formation of nanovoids in a metallic nanostamp, causing degradation of the stamp performance. To prevent the formation of nanovoids, we controlled the current waveform during the electroforming process. In this way, the process suppressed the formation of nanovoids, while effectively achieving a uniform current distribution. As practical examples, two types of metallic nanostamps were fabricated via direct current and PRC electroforming processes, one with a pitch of 0.8 mu m and a height of 1.8 mu m, and another with a pitch of 350 nm and a height of 525 nm. The internal nanovoids developed during the electroforming process were measured and analyzed.
URI
http://hdl.handle.net/YU.REPOSITORY/28044http://dx.doi.org/10.1088/0960-1317/22/6/065004
ISSN
0960-1317
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공과대학 > 기계공학부 > Articles
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