Experimental and analytical study on chip hot spot temperature

Title
Experimental and analytical study on chip hot spot temperature
Author(s)
변찬추교성[추교성]김성진[김성진]
Keywords
SPREADING RESISTANCE
Issue Date
201102
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Citation
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.54, no.9-10, pp.2066 - 2072
Abstract
In this study, the effects of various chip thicknesses on the chip hot spot temperature are investigated using both experimental and analytical methods. The temperature distribution in the chip is measured under the various chip thicknesses (21.5-400 mu m) and various heater power conditions (0.2-0.5 W). In order to support the experimental data and gain a physical insight, closed-form analytic expressions are suggested. Based on the suggested analytic expressions, the effects of the nondimensional contact radius, nondimensional substrate thickness, and the Biot number are investigated. (C) 2010 Elsevier Ltd. All rights reserved.
URI
http://hdl.handle.net/YU.REPOSITORY/25665http://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.12.022
ISSN
0017-9310
Appears in Collections:
공과대학 > 기계공학부 > Articles
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