Electrochemical Formation of Cu Nanowires on W Surface Patterned by Atomic Force Microscope Tip

Title
Electrochemical Formation of Cu Nanowires on W Surface Patterned by Atomic Force Microscope Tip
Author(s)
김수현김선정[김선정]박계순[박계순]
Keywords
SEEDLESS COPPER ELECTRODEPOSITION; ARRAYS; NANOLITHOGRAPHY; TEMPLATE
Issue Date
201109
Publisher
ELECTROCHEMICAL SOC INC
Citation
ELECTROCHEMICAL AND SOLID STATE LETTERS, v.14, no.11, pp.D103 - D106
Abstract
Cu nanowires are directly patterned on W diffusion barrier surface by electrodeposition without using any template. Prior to Cu nanowire growth, a photoresist (PR) film coated over the W surface was mechanically patterned in a random manner with atomic force microscope (AFM) tip. Polycrystalline Cu nanowires in the shape of beaded string were electrochemically formed along line patterns on the W surface. This new approach of Cu nanowire synthesis suggests the feasibility of fabricating Cu interconnects for Si-based electronic devices by direct Cu nanowire patterning. (C) 2011 The Electrochemical Society. [DOI: 10.1149/2.024111esl] All rights reserved.
URI
http://hdl.handle.net/YU.REPOSITORY/24570http://dx.doi.org/10.1149/2.024111esl
ISSN
1099-0062
Appears in Collections:
공과대학 > 신소재공학부 > Articles
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