Aerosol based fabrication of a Cu/polymer and its application for electromagnetic interference shielding

Title
Aerosol based fabrication of a Cu/polymer and its application for electromagnetic interference shielding
Author(s)
변정훈김장우[김장우]
Keywords
ELECTROLESS SILVER DEPOSITION; ALTERNATIVE PROCESS; HEAT-TREATMENT; PET FABRICS; COPPER; FIBER; ACTIVATION; NANOPARTICLES; COMPOSITES; PARTICLES
Issue Date
201111
Publisher
ELSEVIER SCIENCE SA
Citation
THIN SOLID FILMS, v.520, no.3, pp.1048 - 1052
Abstract
The effect of a catalytic surface activation on the electromagnetic interference shielding of Cu deposited polymer substrates was investigated. The surface of polymer substrates was catalytically activated by different methods respectively adopted Pd aerosol nanoparticles and Sn-Pd wet chemical processes. Although both activations initiated the deposition of Cu on the substrates, differences such as morphology (Pd aerosol: similar to 80 nm vs Sn-Pd: similar to 140 nm, in Cu grain size) and composition (Pd aerosol: Cu and Pd vs Sn-Pd: Cu, Pd, Sn, and Cl) of Cu deposits were presented. Specimens activated using Pd aerosol nanoparticles showed a higher range of shielding effectiveness by about 4-10 dB than those activated by Sn-Pd processes in 2-18 Ghz frequencies. (C) 2011 Elsevier B.V. All rights reserved.
URI
http://hdl.handle.net/YU.REPOSITORY/24273http://dx.doi.org/10.1016/j.tsf.2011.08.064
ISSN
0040-6090
Appears in Collections:
공과대학 > 기계공학부 > Articles
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