Novel electroless copper deposition on carbon fibers with environmentally friendly processes

Title
Novel electroless copper deposition on carbon fibers with environmentally friendly processes
Author(s)
변정훈김장우[김장우]
Keywords
AEROSOL NANOPARTICLES; METAL-DEPOSITION; PLATING METHOD; HOLLOW-FIBER; NO REMOVAL; SILVER; CATALYST; METALLIZATION; ACTIVATION; TEMPLATE
Issue Date
201008
Publisher
ACADEMIC PRESS INC ELSEVIER SCIENCE
Citation
JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.348, no.2, pp.649 - 653
Abstract
A novel electroless deposition (ELD) of copper (Cu) on carbon fibers (CFs) with environmentally friendly processes, silver (Ag) aerosol activation and subsequent nonformaldehyde Cu ELD, was developed. Spark-generated Ag aerosol nanoparticles (similar to 10 nm in mode diameter) were deposited (48.4 mu g Ag/g CF in activation intensity) onto the surfaces of CFs. After annealing (at 220 degrees C in a nitrogen atmosphere), the catalytically activated CFs were placed into a solution for Cu ELD (at 82 degrees C). Homogeneous Cu coating (similar to 5.1 nm/min) on CFs was achieved with 90 min of deposition and the corresponding mass deposition rate and Cu grain size for 30-90 min of deposition had ranges of 0.25-1.14 mg Cu/g CF-min and 14.8-37.2 nm, respectively. The porosity of CFs decreased by depositing the Cu for 30-90 min, and the specific surface area and pore volume of CFs decreased from 1536 to 1399 m(2)/g and from 0.65 to 0.57 cm(3)/g, respectively. (C) 2010 Elsevier Inc. All rights reserved.
URI
http://hdl.handle.net/YU.REPOSITORY/23815http://dx.doi.org/10.1016/j.jcis.2010.05.008
ISSN
0021-9797
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공과대학 > 기계공학부 > Articles
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