Browsing by Author 신동길

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Showing results 1 to 10 of 10

Issue DateTitleAuthor(s)
2014-01Analysis of Asymmetric Warpage of Thin Wafers on Flat Plate Considering Bifurcation and Gravitational Force신동길; J.J. LEE[J.J. LEE]
2013-08Characteristics of aluminum/CFRP short square hollow section beam under transverse quasi-static loading신동길; Kim, Hee Chul[Kim, Hee Chul]; Lee, Jung Ju[Lee, Jung Ju]
2015-01Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip신동길; J.J. Lee[J.J. Lee]; C.K. Yoon[C.K. Yoon]; G.J. Lee[G.J. Lee]; J.K. Hong[J.K. Hong]; N.S. Kim[N.S. Kim]
2010-06Effect of PCB Surface Modifications on the EMC-to-PCB Adhesion in Electronic Packages신동길; Y.H. Song[Y.H. Song]; J. Im[J. Im]
2012-10Influence of compressive load conditions and thickness on the two-way shape memory behavior in tube-shaped NiTi alloy신동길; Yoo, Young Ik[Yoo, Young Ik]; Lee, Chang Ho[Lee, Chang Ho]; Lee, Jung Ju[Lee, Jung Ju]
2014-01Numerical analysis of the damage behavior of an aluminum/CFRP hybrid beam under three point bending신동길; 김희철[김희철]; 이정주[이정주]
2013-03Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests신동길; Im, Jay[Im, Jay]
2015-05Tensile behavior of aluminum/carbon fiber reinforced polymer hybrid composites at intermediate strain rates신동길; J.G. Kim[J.G. Kim]; H.C. Kim[H.C. Kim]; J.B. Kwon[J.B. Kwon]; J.J. Lee[J.J. Lee]; H. Huh[H. Huh]
2012-06Theoretical Analysis of the Deflection of a Cantilever Plate for Wirebonding on Overhang Applications신동길; Lee, Jung Ju[Lee, Jung Ju]
2014-04Time-dependent adhesion of a polydimethylsiloxane (PDMS) elastomer film to a flat indenter tip characterized using a cohesive-zone law신동길; N.T. Mai[N.T. Mai]; S.T. Choi[S.T. Choi]; K.H. Chung[K.H. Chung]; S.R. Lee[S.R. Lee]; Y.Y. Earmme[Y.Y. Earmme]

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